RD ALFA Microelectronics Develops Advanced UV-C Photodetectors with Leading Research PartnersRD ALFA Microelectronics is proud to announce its role in the newly launched “GoFarUV” industrial research project, in collaboration with the Institute of Solid State Physics, University of Latvia (LU CFI), and AGL Technologies. Together, we are developing next-generation solar-blind UV-C photodetectors based on amorphous Aluminium Gallium Oxide (AlGaO) thin films. These novel detectors will be fabricated using high-rate magnetron sputtering and integrated into advanced optoelectronic packages by our engineering team. The detectors are designed for precise environmental and atmospheric monitoring, with additional applications in aerospace, defense, and security. This project strengthens RD ALFA’s position as a key contributor to Europe’s high-value space and photonics sectors. Our team leads the development of innovative chip packaging technologies, enabling sensing down to 200 nm wavelengths—essential for detecting ozone levels, wildfires, and UV radiation in harsh environments. Through GoFarUV, we aim to enhance Latvia’s export potential and contribute to European non-dependence in critical semiconductor technologies. The project is supported by the European Regional Development Fund (ERDF), with a total budget of 651,600 EUR. This effort reflects our long-term commitment to advanced R&D and collaboration between industry and academia. (More)

ESA Co-funded Project Successfully Completed: αRD139A and αRD1567 ICs Fully QualifiedThe ESA co-funded project "Qualification and Research of Analog IC Elements Resistance to Radiation" (Contract No. 4000137307/22/NL/GLC/zk) has successfully qualified the αRD139A and αRD1567 ICs. This joint project, which consolidated several proposals previously submitted to ESA, has achieved significant advancements in radiation-hardened analog IC technology. (More)

LEO Kompetences Centra pētījuma Nr. 1.6. īstenošanas progress, 30.06.2024.A/S “RD ALFA MIKROELEKTRONIKAS DEPARTAMENTS” ir īstenojis pētījumu Nr. 1.6. “Zema sprieguma un zema trokšņu līmeņa vienpakāpju Rail-to-Rail operacionālā pastiprinātāja tehnoloģijas un mikroshēmas prototipa izpēte un izstrāde”. Pētījumu līdzfinansē Eiropas savienība. Pētījuma izpildes periods 01.02.2023. - 30.06.2024. (More)